SINTAIKE STK-7200V全自动晶圆切割贴膜机（真空）
产品简介
详细信息
全自动晶圆切膜机（真空）STK-7200V特点： |
无滚轮的特殊真空安装技术(滚轮安装可选) |
配置进口多轴晶圆搬运机械手臂 |
可以应对更薄的晶圆进行切割膜的贴膜 |
晶圆位置和翘曲智能反馈 |
17英寸触摸屏液晶工业电脑控制 |
贴膜动作：全自动拉膜和贴膜，收废膜 |
如需详细参数 欢迎您联系我们
STK-7200V Fully Automatic Wafer Vacuum Mounter Specifications： |
Wafer Size | Diameter:4”, 5”, 6” & 8” |
Wafer Thickness | 80 ~ 750 um |
Wafer material | Si, SiC |
Wafer Type | Single Flat, Double Flat or V-Notch |
Tape Type | Blue Tape or UV Tape Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm |
Frame Type | 6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified |
Mounting Theory | Vacuum Mounting |
Wafer Place Accuracy | X-Y: +/- 0. 1 mm Θ: +/- 0.1° |
Input & Output | Dual Input Wafer Cassette / Single Output Frame Cassette |
ESD Control | ESD Roller / ESD Wafer Chuck / ESD Ion Blower |
Wafer Transfer | Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector Wafer Position & Warpage Intelligent Mapping in Cassette |
Wafer Alignment | Fiber Sensor for Wafer Alignment |
Control Unit | Standard Industrial PC with 17” Touch Panel LCD / Windows O/S |
Power Supplier | Single Phase AC 220 V, 25A |
Air Supplier | 5.0 Kgf/cm2 CDA, 150 L/min |
Machine Construction | Made of Full Aluminium Profile |
Dimensions | 1750 mm (W) × 1350 mm (D) × 1800 mm (H) |
Net Weight | 870 Kg |