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DDR3 Main Memory Interposers
面议DDR4 Main Memory Interposers
面议DDR5 Main Memory Interposers
面议LPDDR3 Mobile Memory Interposers
面议LPDDR5 Mobile Memory Interposers
面议MA4100 Series Memory Analyzer
面议BusXpert Micro II SAS/SATA Analyzer
面议MA5100 Series Memory Analyzer
面议BusFinder (BF7264B / B+) NAND FLASH协议分析仪
面议KODIAK™ PCIE GEN4 ANALYSIS SYSTEM
面议UFS Protocol Analyzer (PGY-UFS3.X-PA)
面议BusFinder (BF7264B / B+) EMMC协议分析仪
面议Low power double-data rate fourth-generation (LPDDR4) mobile memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in handheld devices or applications where low-power and small size is critical.
Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to LPDDR4 mobile memory buses for debug and compliance verification. …
LPDDR4 mobile memory is available in standard Ball-Grid-Array (BGA) component packages. Standard BGA packages are soldered directly to the printed circuit board (PCB). Interposers are available for component packages detailed below:
Interposers | Options | ||||
---|---|---|---|---|---|
Oscilloscope | MA Instrument | ||||
Package (ChxDb) | EdgeProbe™ | Direct Attach | Logic Compliance | Riser | Component Socket |
149 Ball (2×16) | * | ✓ | ✓ | Yes | No |
200 Ball (2×16) | ✓ (XH) | ✓ (XH) | ✓ | Yes | Yes |
254 Ball (2×16) | * | ✓ (XH) | ✓ | Yes | Yes |
272 Ball (4×16) | ✓ | ✓ | ✓ | Yes | Yes |
366 Ball (4×16) | * | ✓ | ✓ | Yes | Yes |
432 Ball (4×16) | * | ✓ | ✓ | Yes | No |
556 Ball | Contact Nexus | Contact Nexus | Contact Nexus | Yes | No |
Custom | Custom designs are also available. Please contact us. |
* If you don’t see what you need, please contact us for the most up to date information.
(XH) XH Series
Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.