品牌
其他厂商性质
深圳市所在地
DDR3 Main Memory Interposers
面议DDR4 Main Memory Interposers
面议LPDDR3 Mobile Memory Interposers
面议LPDDR4 Mobile Memory Interposers
面议LPDDR5 Mobile Memory Interposers
面议MA4100 Series Memory Analyzer
面议BusXpert Micro II SAS/SATA Analyzer
面议MA5100 Series Memory Analyzer
面议BusFinder (BF7264B / B+) NAND FLASH协议分析仪
面议KODIAK™ PCIE GEN4 ANALYSIS SYSTEM
面议UFS Protocol Analyzer (PGY-UFS3.X-PA)
面议BusFinder (BF7264B / B+) EMMC协议分析仪
面议Double-data rate fifth-generation (DDR5) main memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in servers, workstations, and high-performance portable applications that require deep memory.
Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to DDR5 main memory buses for debug and compliance verification…
DDR5 main memory is available in standard Ball-Grid-Array (BGA) component packages as well as dual-inline-memory-modules of DIMM and SODIMM. Standard BGA packages are soldered directly to the printed circuit board (PCB) while modules comprise a series of packages in a standard PCB format with standard connections between the DIMM and the main board. Interposers are available for both component packages and DIMM and SODIMM modules.
Interposers | Options | ||||||
---|---|---|---|---|---|---|---|
Oscilloscope | MA Instrument | ||||||
Package | Balls | EdgeProbe™ | Direct Attach | Target Socketed | Target Socketed | Riser | Component Socket |
x4/x8 | 78 | ✓(XH) | ✓(XH) | ✓(XH) | * | Yes | Yes |
x16 | 96 | * | * | * | * | Yes | Yes |
RCD | 240 | * | ✓(XH) | * | * | Yes | No |
Data Buffer | 55 | * | ✓(XH) | * | * | Yes | No |
RDIMM | 288 pin RDIMM Interposer | ||||||
Custom | Custom designs are also available. Please contact us. |
* If you don’t see what you need, please contact us for the most up to date information.
(XH) XH Series
Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.